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  • Call for Papers (Special Issue on Advanced Technology in the More-than-Moore Era)

    Call for Papers

    Over the past decades, the mainstream of integrated circuit (IC) industry has been mainly powered by Moore’s Law, which is targeted at achieving faster operation speed, less power dissipation, and lower cost. The key driving force behind Moore's Law is the ongoing MOSFET scaling down to nanoscales. However, this trend is beginning to bump up against the fundamental physical limits on their size, which means the approaching end of the Moore’s Law. Different and revolutionary strategies and approaches are highly and urgently needed to meet the requirements of faster, cheaper, and more energy efficient in the More-than-Moore Era.


    This Special Issue is aiming at showcasing the most recent developments and the state-of-the-art in the field of the future/novel microelectronic devices and architectures for the More-than-Moore Era. We invite submissions of new and original materials that have not been copyrighted, published or accepted for publications in any other archival publication to this special issue.


    Topics of interest include (but are not limited to) the following:

    l Advanced CMOS: Material Fundamentals / Process Science / Device Physics / Transistor Architectures

    l Advanced and Emerging Memories / New Applications

    l Advanced Computing Architecture / Application

    l Low Dimensional Devices and Materials

    l Photonics Devices / Integration / Related Technology

    l Photovoltaic / Energy Harvesting / Battery-related Technology

    l Interconnect / 3D Integrations / MEMS

    l Power / High-speed Devices and Materials


    Guest Editor-in-Chief: Prof. Yue Hao

    Yue Hao, a Professor of Xidian University, is an Academician of Chinese Academy of Sciences (CAS), a microelectronics expert, the Convener of the 7th discipline appraisal group (electronic science and technology level of discipline) of the State Council, the Chairman of the teaching guide committee of electronic information engineering major in higher education, and the Director of the National Natural Science Fund Committee of Information Science.


    Professor Hao has been engaged in scientific research and talent training in the fields of new-type wide bandgap semiconductor materials and devices, micro-and-nanometer semiconductor devices and highly reliable integrated circuits for a long time. He has made systematic creative achievements both in research on and in promotion of the third-generation gallium nitride/silicon carbide (wide bandgap) semiconductor functional materials & microwave devices, and semiconductor illuminating short-wavelength photoelectric materials & devices and in the research on the reliability andmicro-nano meter CMOS/beyond and novel memory devices. Up to now, Professor Hao has published more than 500 SCI articles; and obtained about hundred authorization of national invention patents. He authored several scientific books and monographs as well, including “Nitride Wide Bandgap Semiconductor Material and Electronic Devices” and so on.


    GUEST EDITORS:

    Prof. Huaqiang Wu, Tsinghua University,

    Email: wuhq@tsinghua.edu.cn

    Prof. Yuchao Yang, Peking University,

    Email: yuchaoyang@pku.edu.cn

    Prof. Qi Liu, Institute of Microelectronics, Chinese Academy of Sciences,

    Email: liuqi@ime.ac.cn

    Prof. Xiao Gong, National University of Singapore,

    Email: elegong@nus.edu.sg

    Prof. Genquan Han, Xidian University,

    Email: gqhan@xidian.edu.cn

    Prof. Ming Li, Institute of Semiconductors, Chinese Academy of Sciences,

    Email: ml@semi.ac.cn


    Manuscript Submission:

    Manuscripts must be prepared according to the 威尼斯’s guidelines, available at, /news/Preparing_Your_Manuscript.htm. Submit your manuscripts directly to the listing guest editors via the e-mail addresses above. Or directly submit via the online submission address at https://mc03.manuscriptcentral.com/jos-iop.

    Please notify well in advance for your intention to submit a research paper.


    Key timetable dates:

    Manuscript Submission Deadline: June 1, 2020

    Publication Date: September 1, 2020


    2020-01-16

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